Description
BGI139 Manual glue tape lamination text_description
  • The desktop compact BGI100 equipment is for the small batch smart card production according to the ISO 7816. It serves for the hotmelt tape application on the microchip film.
    Operator unrolls the microchip film manually and positions it under the lamination tool made of brass. BGI ships the equipment with one lamination pressor. Operator can replace tools in few minutes.
    One can work with pressors of any size (11.8 х 13 mm, 10.8 х 13 mm, 8.32 х 11 mm, etc. It is possible to punch microchips with glue applied from the film on BGI062 equipment.

    • Speed – up to 3000 CPH depending on operator skills
    • Standard 35 mm film
    • Depth – 300 mm
    • Width – 410 mm
    • Height – 350 mm
    • Weight – 15 kg
    • Electricity – 220 V, 50 Hz, 250 Wt
    • Compressed air – 6 bar, 8 l/min.
    • Operating temperature +10 - +40 0 С
    • Warranty – 1 year
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