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Q-Card 4-in-1

Module Adhesion and Peel Tester

Q-Card’s module adhesion/peel tester is appropriate for performing the following tests.

Peel Strength
• ISO/IEC 10373-1:2006, Section 5.3: Peel Strength
• ANSI/INCITS 322-2008, Section 5.2: Peel Strength—90° Peel Angle
• MasterCard CQM v2.03:2013, Section 9.1.15, Solidity/Peel Strength, TM-412 (old CQM v1.9: P-11)

Module Adhesion
• ANSI/INCITS 322-2008, Section 5.22: IC Card with Contacts Micromodule Adhesion Test
• MasterCard CQM v2.03:2013, Section 13.2.1.33: Solidity: Back of Card Spot Pressure Test, TM-423 (old CQM v1.9: P-24)

Test package for combination module adhesion/ peel tester includes a motorized test stand, digital force gauge, AC adapter/charger for 115VAC or 230VAC, data acquisition and exporting software, scoring fixture, glue fixture, ISO 9001 certification and necessary attachments and cables to perform the above tests.

Electrical
• Max Load: 110 lbf
• Speed: .4"~ 12"/minute
• Stroke: 14" (356mm)
• Power: 115/230 VAC
• RS-232 Port

Environmental
• The gauge can be used between 30-100°F (0-40°C)

For Data Acquisition
• PC computer with Windows XP or later and Excel
2000 or later.

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