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BGI175B

BGI175B
ICM adhesion test for smart cards
Full description

This equipment follows CQM 2020: TM-423 #8230# norm.
It is also known as Back of card spot pressure test.

  • Test further than the norm
  • Optional driller tool to prepare the card
Advantages
  • Easy to use to precut peel strength strips
  • Stand alone equipment with color screen touch interface
  • Graphic return of the test
  • Create and save up to 30 programming test sessions
  • Possibility to modify parameters to test futher than the norm
  • Tests for contact, magstripe, dual, combi and customized cards with embossed characters
  • Works with driller tool: BGI120C

Option
  • Tool to perform GSM/SIM plug push

  • Dimensions: 340 x 320 x 720mm
  • Weight: 18,1 Kg
Send a request
cities cities cities cities cities
mn-fr 10.00 - 18.00
117342, Moscow,
Butlerova st., 17, 6th floor