BGI175B
ICM adhesion test for smart cards
Full description
ICM adhesion test for smart cards
Option
Description
This equipment follows CQM 2020: TM-423 #8230# norm.
It is also known as Back of card spot pressure test.
It is also known as Back of card spot pressure test.
- Test further than the norm
- Optional driller tool to prepare the card
Advantages
- Easy to use to precut peel strength strips
- Stand alone equipment with color screen touch interface
- Graphic return of the test
- Create and save up to 30 programming test sessions
- Possibility to modify parameters to test futher than the norm
- Tests for contact, magstripe, dual, combi and customized cards with embossed characters
- Works with driller tool: BGI120C
Option
- Tool to perform GSM/SIM plug push
Specification
- Dimensions: 340 x 320 x 720mm
- Weight: 18,1 Kg
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